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The electronics packaging as part of the product development

Today’s electronic products cannot be conceived without an accurate combination of electronics together with mechanics. The electronics packaging will be the link between these two disciplines.

Mechanical engineering principles, such as dynamics, stress analysis, heat transfer and fluid mechanics, need to be taken into consideration to design a proper electronics enclosure. The environmental conditions the product will be exposed to will also define the mechanical design around electronics. 

The product development process should then include a close interaction between mechanical engineers and electronics design engineers. 

With the above said, to get the right products to market faster and exceed customer expectations, DigiProces Technology Center has a distinctive mechanical integration background that allows us to create the best-in-class finished products.

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